激光半导体

料条打标设备:LSM3000

优点介绍

具有激光功率自动校正功能
可打标高翘曲产品,翘曲度≤4mm
具有振镜自动校正,料条方向检测,相机对位和打标自检功能
最小打标字符高度0.2mm
可打标不同厚度的料条
Equipped with laser power automatic calibration function
Can be used for elevation warping products, with a warping degree of ≤ 4mm
Equipped with automatic scanner calibration , strip direction detection, camera alignment, and self checking functions for marking
Minimum marking character height 0.2mm
Strip with different thickness can be marked

参数配置

功能描述

适用产品:半导体料条
主要功能:实现料条正面激光标记功能
进出料方式:料盒 & 堆库
尺寸:L2550 * W1590 * H1850mm
Applicable products: Semiconductor strips
Main function: to achieve laser marking function on the front of the material strip
Import and export method: material box & stacking warehouse
Size: L2550 * W1590 * H1850mm