晶圆正面激光打标设备：SSTM3000

优点介绍

具有激光功率自动补偿功能
可用于晶圆ID打标/特殊芯片打标/不合格芯片打标
配有金属料盒/拾取&放置/定位相机/OCR识别/打标头，用于激光打标和实时监控打标位置和晶圆打标识别
配有 振镜自动校正功能，自动偏移补偿功能和铁环晶圆中心补正功能
可自动切换打标模式为 晶圆ID打标/不合格芯片打标/特殊芯片打标
Equipped with laser power automatic compensation function
Can be used for wafer ID marking / reference die marking / rejected die marking.
Equipped with metal cassettes / pick & place / align vision / OCR reader / marking head , for laser marking and real-time monitoring of marking positions and wafer marking recognition. 
Equipped with automatic scanner calibration , automatic offset compensation, and iron ring wafer center compensation functions
Automatic switching of marking mode for wafer ID / rejected die / reference die marking

参数配置

功能描述

适用产品：铁环 8英寸、12英寸晶圆
主要功能：在晶圆正面实现晶圆ID打标/不合格芯片打标/特殊芯片打标
进出料方式：金属料盒、铁环晶圆
设备尺寸：L2200 * W2000 * H1850mm
Applicable products: 8-inch, 12 inch wafers mounted on ring frame carrier. 
Main function: To achieve laser marking for wafer ID/rejected die/
reference die on the wafer front side
Import and export method: Metal Cassettes,Ring Frame wafer
Size: L2200 * W2000 * H1850mm